What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Nanoelectronics deal with extremely small electronic components — transistors, sensors and circuits that can fit on the tip of a needle. This technology powers our everyday lives through devices such ...

SUNNYVALE, Calif., Sept. 24, 2025 /PRNewswire/ -- Synopsys, Inc. (SNPS), (NASDAQ: SNPS) today announced TSMC has certified the Ansys portfolio of simulation and analysis solutions, enabling accurate ...

At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0... Artificial ...

Developing economies do not have to invest billions of dollars in state-of-the-art fabs to get into the semiconductor industry, according to Sadeg Faris, chairman and chief executive officer of Reveo ...