In recent years, 3D printing has captured the imagination of innovators across a wide array of industries, and the packaging sector is no exception. As brands seek smarter, more sustainable ways to ...

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...

The global AI in packaging design market reached USD 2.82 billion in 2024 [1] and is expanding at a 12.2% CAGR [2] through ...

Fig 1. The system-in-package approach is part of the trend toward thinner and more integrated 3D IC packages for CPUs, GPUs, and FPGAs for use in camera modules and wireless products, where high ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

In the realm of advanced medical device development, Switzerland’s Oertli Instrumente AG has transformed its prototyping and packaging processes by integrating the Mayku Mulitplier pressure former ...

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up.