SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

About 30% of plastics consumed are made to last forever but are discarded after a single use. Researchers at Virginia Tech ...

Papyrus Australia has developed a proprietary technology to convert banana plantation waste into pulp for use in food ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

Romaco to present sustainable Unity 600 high-speed blister packaging line at interpack 2026: Karlsruhe, Germany Monday, April 27, 2026, 14:00 Hrs [IST] Romaco Group, a leading int ...

Nextek and Coveris launch COtooCLEAN plant to recycle mixed films into food-grade resins using advanced CO₂ technology ...

At this year’s Interpack, the Romaco Group will present its sustainable Unity 600 high-speed blister packaging line, ...

CEO Pat Gelsinger joins Syenta’s board as it raises $26M to commercialize AI chip advanced packaging tech—boost bandwidth, ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

A new manufacturing technology has been developed for the continuous production of large-area flexible printed circuit boards ...

At Interpack 2026, Romaco Kilian will be presenting the KTS 840 – its new tablet press for triple-layer applications.

But the inability to utilize leading-edge process nodes has created opportunities for small and midsize chip developers in ...